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BS PD IEC TR 60286-7:2019

Packaging of components for automatic handling-Introduction of a bulk blister pack for miniaturized components

standard by BSI Group , 10/29/2019

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Full Description

This part of IEC 60286 contains information about the introduction of an innovative bulk blister packing system for miniaturized components, for example chip type components of size 1005 (metric) and smaller. It includes a proposal for standardization of the interface between the packaging and automatic assembly systems and requirements to the properties of the packaging.

Cross References:
IEC 60286-3:2019
IEC 61340-5-3:2015
IEC 62090:2017
IEC 61340-5-1:2016


All current amendments available at time of purchase are included with the purchase of this document.
 

Product Details

Published:
10/29/2019
ISBN(s):
9780539032666
Number of Pages:
16
File Size:
1 file , 1.9 MB
Product Code(s):
30388258, 30388258, 30388258
Note:
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