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About This Item

 

Full Description

BS EN ISO 9455-14:2017 specifies a qualitative method for the assessment of the tackiness of the residues of a soft soldering flux after a soldering process. The method is applicable to all fluxes, solder pastes and flux cored solder wires. The method is particularly appropriate for applications where flux residues are left in situ on electrical and electronic equipment.


Cross References:
ISO 9453:2014 ED3
ISO 197-1
ISO 9455-1:1990 (R10)
ISO 9455-2:1993 (R07)


All current amendments available at time of purchase are included with the purchase of this document.
 

Document History

  1. BS EN ISO 9455-14:2017

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    Soft soldering fluxes. Test methods-Assessment of tackiness of flux residues

    • Most Recent
  2. BS EN 29455-14:1993


    Soft soldering fluxes. Test methods-Assessment of tackiness of flux residues

    • Historical Version