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  1. MOST RECENT

    Conf

    IPC APEX-EXPO19

    IPC APEX 2019 Technical Conference Proceedings

    Conference Proceeding by Association Connecting Electronics Industries, 04/11/2019.

    Languages: English

  2. MOST RECENT

    2043037

    IPC WP-025

    IPC White Paper on A Framework for the Engineering and Design of E-Textiles

    standard by Association Connecting Electronics Industries, 03/01/2019.

    Languages: English

  3. MOST RECENT

    2042248

    IPC 2591

    Connected Factory Exchange (CFX)

    standard by Association Connecting Electronics Industries, 03/01/2019.

    Languages: English

  4. MOST RECENT

    2042247

    IPC 1791- Amendment 1

    Trusted Electronic Designer, Fabricator and Assembler Requirements, Amendment 1

    Amendment by Association Connecting Electronics Industries, 03/01/2019.

    Languages: English

  5. MOST RECENT

    2033212

    IPC 9111

    Troubleshooting for Printed Board Assembly Processes

    standard by Association Connecting Electronics Industries, 01/01/2019.

    Languages: English

  6. MOST RECENT

    2033213

    IPC 9301

    Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability

    standard by Association Connecting Electronics Industries, 12/01/2018.

    Languages: English

  7. MOST RECENT

    2031398

    IPC 6012DA-WAM1

    Automotive Applications Addendum to IPC-6012D, Qualficiation and Performance Specification for Rigid Printed Boards

    Amendment by Association Connecting Electronics Industries, 12/01/2018.

    Languages: English

  8. MOST RECENT

    2025947

    IPC WP-019A

    White Paper on Global Change in Ionic Cleanliness Requirements

    standard by Association Connecting Electronics Industries, 10/03/2018.

    Languages: English

  9. MOST RECENT

    2025948

    IPC J-STD-001G - Amendment

    Requirements for Soldered Electrical and Electronic Assemblies

    Amendment by Association Connecting Electronics Industries, 10/01/2018.

    Languages: English

  10. MOST RECENT

    2022822

    IPC PERM-WP-022

    White Paper on Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow - Results of an Industry Round-Robin - Final Report

    standard by Association Connecting Electronics Industries, 09/05/2018.

    Languages: English