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About This Item

 

Full Description

SAE AMS3731/10C covers an unfilled, room-temperature-polymerizing epoxy resin formulation with a polyamide hardener, supplied as a two-component system.
 

Document History

  1. SAE AMS3731/10C

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    POTTING COMPOUND, EPOXY Bisphenol A-Type Unfilled, Room Temperature Cure, Semiflexible (Stabilized: Nov 2017)

    • Most Recent
  2. SAE AMS3731/10B


    POTTING COMPOUND, EPOXY Bisphenol A-Type Unfilled, Room Temperature Cure, Semiflexible (Noncurrent: Jan 1993)

    • Historical Version