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JEDEC J-STD-035A

JOINT IPC/JEDEC STANDARD FOR ACOUSTIC MICROSCOPY FOR NONHERMETRIC ENCAPSULATED ELECTRONIC COMPONENTS

standard by JEDEC Solid State Technology Association , 12/01/2022

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Full Description

This method provides users with an acoustic microscopy process flow for detecting anomalies (delaminations, cracks, mold compound voids, etc.) nondestructively in encapsulated electronic devices while achieving reproducibility.

 

Product Details

Published:
12/01/2022
Number of Pages:
26
File Size:
1 file , 1.2 MB
Note:
This product is unavailable in Russia, Ukraine, Belarus
 

Document History

  1. JEDEC J-STD-035A

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    JOINT IPC/JEDEC STANDARD FOR ACOUSTIC MICROSCOPY FOR NONHERMETRIC ENCAPSULATED ELECTRONIC COMPONENTS

    • Most Recent

  2. JEDEC J-STD-035


    JOINT IPC/JEDEC STANDARD FOR ACOUSTIC MICROSCOPY FOR NONHERMETRIC ENCAPSULATED ELECTRONIC COMPONENTS

    • Historical Version