1825151

JEDEC J-STD-033C

JOINT IPC/JEDEC STANDARD FOR HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE-MOUNT DEVICES

standard by JEDEC Solid State Technology Association , 12/01/2011

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Full Description

The advent of surface mount devices (SMDs) introduced a new class of quality and reliability concerns regarding damage from the solder reflow process, such as cracks and delamination. This document describes the standardized levels of floorlife exposure for moisture/reflow sensitive SMDs along with the handling, packing, and shipping requirements necessary to avoid moisture/reflow related failures. Companion documents J-STD-020 and J-STD-075 define the classification procedure and JEP113 defines the labeling requirements.
 

Product Details

Published:
12/01/2011
Number of Pages:
18
File Size:
1 file , 500 KB
Note:
This product is unavailable in Russia, Ukraine, Belarus
 

Document History

  1. JEDEC J-STD-033D


    Handling, Packing, Shipping, and Use of Moisture/Reflow Sensitive Surface-Mount Devices

    • Most Recent

  2. JEDEC J-STD-033D


    Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices

    • Historical Version

  3. JEDEC J-STD-033C

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    JOINT IPC/JEDEC STANDARD FOR HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE-MOUNT DEVICES

    • Historical Version

  4. JEDEC J-STD-033B.1


    JOINT IPC/JEDEC STANDARD FOR HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE-MOUNT DEVICES

    • Historical Version

  5. JEDEC JEP113-B


    SYMBOL AND LABELS FOR MOISTURE-SENSITIVE DEVICES

    • Historical Version