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IPC J-STD-033C-1

Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

standard by Association Connecting Electronics Industries , 08/01/2014

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About This Item

 

Full Description

Provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components. These procedures provide a minimum shelf life of 12 months from the seal date when properly implemented. Developed by IPC and JEDEC.
 

Product Details

Published:
08/01/2014
ISBN(s):
9781611930375
Number of Pages:
28
File Size:
1 file , 760 KB
Note:
This product is unavailable in Russia, Ukraine, Belarus
 

Document History

  1. IPC J-STD-033D


    Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices

    • Most Recent

  2. IPC J-STD-033C-1

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    viewing


    Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

    • Historical Version

  3. IPC J-STD-033C


    Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices, Includes Amendment 1 (2007)

    • Historical Version

  4. IPC J-STD-033B


    Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices, Includes Amendment 1 (2007)

    • Historical Version

  5. IPC J-STD-033


    Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

    • Historical Version