2210471

IPC J-STD-006C-AM1

Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications - Amendment 1

Amendment by Association Connecting Electronics Industries , 10/01/2017

This document is an amendment. View the base document.

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The J-STD-006C-AM1 amendment provides better detail of a solder alloy's maximum allowed deviation about the nominal level of the element's mass than was provided in past alloy standards. The J-STD-006C-AM1 amendment provides information on negative effects of adding rare earth elements to specific, heavy tin-containing, lead-free solder alloys and propensity of tin whisker formation. Finally, the J-STD-006C-AM1 amendment inserted five new, patented lead-free solder alloys from 3 separate alloy suppliers for users of the J-STD-006C standard.
 

Product Details

Published:
10/01/2017
Number of Pages:
12
File Size:
1 file , 280 KB
Note:
This product is unavailable in Russia, Ukraine, Belarus