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About This Item

 

Full Description

This standard prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs and tabs. A test method for the resistance to dissolution/dewetting of metallization is also included in the standard. Intended for use by both vendors and users, J-STD-002D was developed by EIA, IPC and JEDEC.
 

Document History

  1. IPC J-STD-002E


    Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

    • Most Recent
  2. IPC J-STD-002D

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    Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

    • Historical Version
  3. IPC J-STD-002C


    Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires, Includes Amendment 1 (November 2008)

    • Historical Version
  4. IPC J-STD-002B


    Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

    • Historical Version