The definitive illustrated guide to printed circuit board acceptability! This four-color document provides photographs and illustrations of the target, acceptable and nonconforming conditions that are either internally or externally observable on bare printed boards. Make sure your operators, inspectors, and engineers have the most current industry consensus information. With over 80 new or revised photographs and illustrations, revision G provides new coverage on topics such as smear removal, lifted lands and wire bond pads along with updated and expanded coverage for measling and crazing of printed boards, annular ring requirements, etchback, foil cracks, flexible circuits, and minimum foil thickness for conductive patterns.