This document is another in a series and specifically addresses preconditioning of non-IC components used in electronic assembly. Do the components work with your process? That determination is the goal of these manufacturing process simulations; to ensure that the components chosen meet expected reliability requirements after exposure to factory processes. Developed for users and manufacturers, the procedure consists of a set of simulations, for non-IC component storage and use, wave and reflow soldering (SMT and PTH parts), exposure to corrosive (water soluble) fluxes, and exposure to often-used cleaning materials.