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About This Item

 

Full Description

Major update for lead free support and enhanced inspection guidelines for repairs and modifications!

This guide includes everything needed for repair and rework of electronic assemblies and printed circuit boards! IPC-7711B/7721B Rework, Modification and Repair of Electronic Assemblies has received a complete procedure by procedure update to assure applicability to both lead free and traditional SnPb soldered assemblies. This single volume includes all previously published changes and several new procedures for BGAs (including reballing) and flex-print repair. Part 1 General Requirements has also been updated for ease of use and provides important direction and guidelines for all procedures. This section includes procedures common to rework, repair and modification. Part 2 is IPC-7711B and the procedures include tools, materials and methods to be used in removing and replacing surface mount and through-hole components. Part 3 is IPC-7721B and includes procedures for modifying assemblies and accomplishing laminate can conductor repairs. This guide is provided in a three ring binder for easy updating. Users can insert company specific procedures, or remove just the pages needed for a specific job to help keep the workbench clear.

Many procedures have color illustrations to help the user understand the guide.
 

Document History

  1. IPC 7711/7721D


    Rework, Modification and Repair of Electronic Assemblies

    • Most Recent
  2. IPC 7711/7721C


    Rework, Modification and Repair of Electronic Assemblies

    • Historical Version
  3. IPC 7711/7721B

    👀currently
    viewing


    Rework, Modification and Repair of Electronic Assemblies

    • Historical Version
  4. IPC 7711/21A


    Rework of Electronic Assemblies & Repair and Modification of Printed Boards and Electronic Assemblies

    • Historical Version
  5. IPC 7711/7721


    Rework of Electronic Assemblies & Repair and Modification of Printed Boards and Electronic Assemblies

    • Historical Version