IPC 4563

Resin Coated Copper Foil for Printed Boards Guideline

standard by Association Connecting Electronics Industries , 11/01/2007

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Full Description

This guideline covers the requirements for resin coated copper foil intended for use in the formation of high density interconnect surface microvias for printed boards and printed board assemblies.

Product Details

Published:: 11/01/2007
Number of Pages:: 19
File Size:: 1 file , 270 KB
Note:: This product is unavailable in Russia, Ukraine, Belarus

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