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IEC/PAS 60191-6-18 Ed. 1.0 en:2008

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

standard by International Electrotechnical Commission - Publicly Available Standard , 01/22/2008

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Full Description

This PAS provides common outline drawings and dimensions for all types of structures and composed materials of ball grid array (hereinafter called BGA), whose terminal pitch is one millimetre or larger and whose package body outline is square.
 

Product Details

Edition:
1.0
Published:
01/22/2008
Number of Pages:
19
File Size:
1 file , 1 MB
Note:
This product is unavailable in Canada
 

Document History

  1. IEC 60191-6-18 Ed. 1.0 b:2010


    Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

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  2. IEC/PAS 60191-6-18 Ed. 1.0 en:2008

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    Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

    • Historical Version