1562444

IEC 62137-1-1 Ed. 1.0 b:2008

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test

standard by International Electrotechnical Commission , 05/14/2008

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Full Description

The test method described in IEC 62137-1-1:2007 is applicable to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate.
 

Product Details

Edition:
1.0
Published:
05/14/2008
Number of Pages:
30
File Size:
1 file , 1000 KB
Note:
This product is unavailable in Ukraine, Russia, Belarus, Canada
 

Document History

  1. IEC 62137-1-1 Ed. 1.0 b:2008

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    Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test

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  2. IEC 62137-1-1 Ed. 1.0 en:2007


    Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test

    • Historical Version

  3. IEC 62137-1-1 Ed. 1.0 b:2007


    Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test

    • Historical Version