1893047

IEC 62047-16 Ed. 1.0 b:2015

Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods

standard by International Electrotechnical Commission , 03/05/2015

View all product details

Most Recent

Track It

Language:
    • Available Formats
    • Options
    • Availability
    • Priced From ( in USD )
    • Printed Edition
    • Ships in 1-2 business days
    • $51.00
    • Add to Cart

Customers Who Bought This Also Bought

 

About This Item

 

Full Description

IEC 62047-16:2015 specifies the test methods to measure the residual stresses of films with thickness in the range of 0,01 μ to 10 μ in MEMS structures fabricated by wafer curvature or cantilever beam deflection methods.
 

Product Details

Edition:
1.0
Published:
03/05/2015
Number of Pages:
21
File Size:
1 file , 420 KB
Note:
This product is unavailable in Ukraine, Russia, Belarus, Canada