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IEC 61190-1-2 Ed. 1.0 b:2002 [ Withdrawn ]

Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly

standard by International Electrotechnical Commission , 03/22/2002

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Full Description

Specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly. Prescribes a quality control document (not intended to relate directly to the material performance in the manufacturing process).
 

Product Details

Edition:
1.0
Published:
03/22/2002
Number of Pages:
35
File Size:
1 file , 1.3 MB
Note:
This product is unavailable in Ukraine, Russia, Belarus, Canada
 

Document History

  1. IEC 61190-1-2 Ed. 3.0 b:2014


    Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

    • Most Recent

  2. IEC 61190-1-2 Ed. 2.0 b:2007


    Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

    • Historical Version

  3. IEC 61190-1-2 Ed. 2.0 en:2007


    Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

    • Historical Version

  4. IEC 61190-1-2 Ed. 1.0 b:2002

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    Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly

    • Historical Version