1038291

IEC 60749-20 Ed. 1.0 b:2002 [ Withdrawn ]

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat

standard by International Electrotechnical Commission , 09/30/2002

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Full Description

Applies to semiconductor devices (discrete devices and integrated circuits) - and provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices.
 

Product Details

Edition:
1.0
Published:
09/30/2002
Number of Pages:
49
File Size:
1 file , 1.7 MB
Note:
This product is unavailable in Ukraine, Russia, Belarus, Canada
 

Amendments, rulings, supplements, and errata

  1. IEC 60749-20 Ed. 1.0 b CORR1:2003

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    Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat