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IEC 60068-2-69 Ed. 1.0 b:1995 [ Withdrawn ]

Environmental testing - Part 2: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method

standard by International Electrotechnical Commission , 12/08/1995

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Full Description

Describes two wetting balance methods. These methods determine quantitatively the solderability of terminations on surface mounted devices. The procedures describe the solder bath wetting balance method and the solder globuwetting balance method and are both applicable to components with metallic termination and metallized solder pads.
 

Product Details

Edition:
1.0
Published:
12/08/1995
Number of Pages:
43
File Size:
1 file , 2 MB
Note:
This product is unavailable in Ukraine, Russia, Belarus, Canada
 

Document History

  1. IEC 60068-2-69 Ed. 3.1 b:2019


    Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method CONSOLIDATED EDITION

    • Most Recent

  2. IEC 60068-2-69 Ed. 3.0 b:2017


    Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

    • Historical Version

  3. IEC 60068-2-69 Ed. 2.0 b:2007


    Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

    • Historical Version

  4. IEC 60068-2-69 Ed. 2.0 en:2007


    Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

    • Historical Version

  5. IEC 60068-2-54 Ed. 2.0 b:2006


    Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method

    • Historical Version

  6. IEC 60068-2-54 Ed. 2.0 en:2006


    Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method

    • Historical Version

  7. IEC 60068-2-69 Ed. 1.0 b:1995

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    Environmental testing - Part 2: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method

    • Historical Version

  8. IEC 60068-2-54 Ed. 1.0 b:1985


    Environmental testing. Part 2: Tests. Test Ta: Soldering - Solderability testing by the wetting balance method

    • Historical Version