ECIA EIA-540HA00 [ Withdrawn ]

Blank Detail Specification for Burn-In Sockets Used with Ball Grid Array Devices for Use in Electronic Equipment

standard by Electronic Components Industry Association , 05/01/2000

Most Recent

W/D NO S/S

The ball grid array (BGA) burn-in sockets of assessed quality covered by this Detail Specification shall have:

— Maximum enclosure (maximum length, width and height dimensions).

— A working voltage not exceeding___ volts (rms).

— Current not exceeding __ ampere per pin.

Device/OS:	Other
Browser:	Generic Browser 0.0
User Agent:	Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; [email protected])
Store Name:	css
Page:	/standards/ecia-eia-540ha00?product_id=2585836
Referrer:	www.techstreet.com/standards/ecia-eia-540ha00?product_id=2585836
IP:	3.22.181.81, 108.162.245.105
Language:	en
Customer #:	Not Logged In
Member?:	YES
Cart #:	1151901410
Order #:	None
Cookies:	NO
×