2585154

ECIA EIA-540GAAA [ Stabilized ]

Detail Specification for Burn-In Sockets for Chip Carrier Packages with Molded Carrier Rings for Use in Electronic Equipment

standard by Electronic Components Industry Association , 10/01/1993

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About This Item

 

Full Description

The Burn-In Sockets of assessed quality covered by this Detail Specification shall have:

a) Maximum enclosure dimensions that include insertion cover and actuator hardware as illustrated in Figure 1.

b) A working voltage not exceeding 125 volts (rms)

c) Current not exceeding 1 ampere per pin

OBJECT

The object of this detail specification is to provide all information required for the identification and quality assessment of the Bum-In Sockets for Chip Carrier Packages that are defined by EIA/JEDEC Publication 95, MO-094. The sockets have solder tail leads. The information contained herein or by reference, is complete and sufficient for inspect ion purposes.

 

Product Details

Edition:
93
Published:
10/01/1993
Number of Pages:
20
File Size:
0 files