Std

DIN EN 61190-1-2 [ Withdrawn ]

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 61190-1-2:2007); German version EN 61190-1-2:2007

standard by DIN-adopted European Standard , 11/01/2007

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Product Details

Published:
11/01/2007
Number of Pages:
22
File Size:
1 file
Product Code(s):
1380769, 1380769
Note:
This product is unavailable in Russia, Ukraine, Belarus
 

Document History

  1. DIN EN 61190-1-2


    Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 61190-1-2:2014); German version EN 61190-1-2:2014

    • Most Recent

  2. DIN EN 61190-1-2/A1 - DRAFT


    Draft Document - Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 91/1023/CD:2011)

    • Historical Version

  3. DIN EN 61190-1-2

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    Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 61190-1-2:2007); German version EN 61190-1-2:2007

    • Historical Version