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BS IEC 61189-5-4:2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies

standard by British Standard / International Electrotechnical Commission , 01/31/2015

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Cross References:
IEC 61189-5
IEC 61189-6
IEC 61190-1-3
IEC 60068-2-20
IEC 61189-1
IEC 61189-2:2006
IEC 61189-3:2007
IEC 61190-1-1
IEC 61190-1-2
IEC 61249-2-7
IEC 62137:2004
ISO 5725-2
ISO 9001
ISO 9455-1
ISO 9455-2
ASTM B-36
IPC-9201:1996
IPC-TR-467:1996


All current amendments available at time of purchase are included with the purchase of this document.
 

Product Details

Published:
01/31/2015
ISBN(s):
9780580812736
Number of Pages:
26
File Size:
1 file , 1.3 MB
Product Code(s):
30274805, 30274805, 30274805
 

Document History

  1. BS IEC 61189-5-4:2015

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    Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies

    • Most Recent

  2. BS 12/30274804 DC


    BS IEC 61189-5-4. Test methods for electrical materials, interconnection structures and assemblies. Part 5-4. Test methods for printed board assemblies. Solder alloys and fluxed and non-fluxed solid wire

    • Historical Version