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About This Item

 

Full Description

This part of IEC 61188 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.

All current amendments available at time of purchase are included with the purchase of this document.
 

Document History

  1. BS EN IEC 61188-6-1:2021

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    Circuit boards and circuit board assemblies. Design and use-Land pattern design. Generic requirements for land pattern on circuit boards

    • Most Recent
  2. BS EN 61188-5-1:2002


    Printed boards and assemblies. Design and use. Attachment (land/joint) considerations-Attachment (land/joint) considerations. Generic requirements

    • Historical Version