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BS 12/30274796 DC

BS IEC 61189-5-2. Test methods for electrical materials, interconnection structures and assemblies. Part 5-2. Test methods for printed board assemblies. Soldering Flux

standard by BSI Group , 11/12/2012

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Cross References:
IEC 60068-1:1988
IEC 60068-2-20
IEC 61189-1
IEC 61189-3
IEC 61189-6
IEC 61190-1-1
IEC 61190-1-2
IEC 61190-1-3
IEC 61249-2-7
IEC 62137:2004
ISO 5725-2
ISO 9001
ISO 9455-1
ISO 9455-2
IPC-9201:1996
IPC-TR-467:1996
ASTM B-36


All current amendments available at time of purchase are included with the purchase of this document.
 

Product Details

Published:
11/12/2012
Number of Pages:
44
 

Document History

  1. BS IEC 61189-5-2:2015


    Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Soldering flux for printed board assemblies

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  2. BS 12/30274796 DC

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    BS IEC 61189-5-2. Test methods for electrical materials, interconnection structures and assemblies. Part 5-2. Test methods for printed board assemblies. Soldering Flux

    • Historical Version