1.1 This practice relates to the radiographic examination of electronic devices for internal discontinuities, extraneous material, missing components, crimped or broken wires, and defective solder joints in cavities, in the encapsulating materials, or the boards. Requirements expressed in this practice are intended to control the quality and repeatability of the radiographic images and are not intended for controlling the acceptability or quality of the electronic devices imaged.

1.2 If a nondestructive testing agency as described in Practice E543 is used to perform the examination, the testing agency should meet the requirements of Practice E543.

1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.