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About This Item

 

Full Description

1.1 This specification covers requirements for electrodeposited coatings of copper used for engineering purposes. Examples include surface hardening, heat treatment stop-off, as an underplate for other engineering coatings, for electromagnetic interferences (EMI) shielding in electronic circuitry, and in certain joining operations.

1.2 This specification is not intended for electrodeposited copper when used as a decorative finish, or as an undercoat for other decorative finishes.

1.3 This specification is not intended for electrodeposited copper when used for electroforming.

 

Document History

  1. ASTM B734-97(2023)


    Standard Specification for Electrodeposited Copper for Engineering Uses

    • Most Recent
  2. ASTM B734-97(2018)


    Standard Specification for Electrodeposited Copper for Engineering Uses

    • Historical Version
  3. ASTM B734-97(2013)

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    Standard Specification for Electrodeposited Copper for Engineering Uses

    • Historical Version
  4. ASTM B734-97(2008)


    Standard Specification for Electrodeposited Copper for Engineering Uses

    • Historical Version
  5. ASTM B734-97(2003)e1


    Standard Specification for Electrodeposited Copper for Engineering Uses

    • Historical Version
  6. ASTM B734-97


    Standard Specification for Electrodeposited Copper for Engineering Uses

    • Historical Version