44635

IPC 6015

Qualification & Performance Specification for Organic Multichip Module Mounting and Interconnecting Structures

standard by Association Connecting Electronics Industries , 02/01/1998

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Full Description

This specification establishes the specific requirements for organic mounting structures used to interconnect chip components, which in combination form the completed functional organic single-chip module (SCM-L) or organic multichip module (MCM-L) assembly and the quality and reliability assurance requirements that must be met for their acquisition. For use with IPC-6011.
 

Product Details

Published:
02/01/1998
Number of Pages:
25
File Size:
1 file , 1.2 MB
Product Code(s):
6015(D)1
Note:
This product is unavailable in Russia, Ukraine, Belarus