235601

IPC 6016

Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards

standard by Association Connecting Electronics Industries , 05/01/1999

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About This Item

 

Full Description

Establishes the specific electrical, mechanical and environmental requirements for organic HDI layers with microvia technology. The acceptance criteria of the HDI layers are organized into specification sheets that reflect typical end-use applications, such as cellular phones, avionics, automotive and personal computers. For use with IPC-6011.
 

Product Details

Published:
05/01/1999
ANSI:
ANSI Approved
Number of Pages:
55
File Size:
1 file , 810 KB
Product Code(s):
6016(D)1
Note:
This product is unavailable in Russia, Ukraine, Belarus
 

Document History

  1. IPC 6012F


    Qualification and Performance Specification for Rigid Printed Boards

    • Most Recent

  2. IPC 6012E


    Qualification and Performance Specification for Rigid Printed Boards

    • Historical Version

  3. IPC 6012D-WAM1


    Qualification and Performance Specification for Rigid Printed Boards, Includes Amendment 1

    • Historical Version

  4. IPC 6012D


    Qualification and Performance Specification for Rigid Printed Boards

    • Historical Version

  5. IPC 6012C


    Qualification and Performance Specification for Rigid Printed Boards

    • Historical Version

  6. IPC 6012B


    Qualification and Performance Specification for Rigid Printed Boards, Includes Amendment 1

    • Historical Version

  7. IPC 6012A-AM


    Qualification and Performance Specification for Rigid Printed Boards - Includes Amendment 1

    • Historical Version

  8. IPC 6016

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    Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards

    • Historical Version