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About This Item

 

Full Description

This document provides guidelines for the design and fabrication of stencils for solder paste and surface mount adhesive with discussion on through-hole and mixed technology. This includes differences for tin lead and lead-free solder paste, overprint, two-print and step stencil designs.
 

Document History

  1. IPC 7525C


    Stencil Design Guidelines

    • Most Recent
  2. IPC 7525B

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    Stencil Design Guidelines

    • Historical Version
  3. IPC 7525B


    Stencil Design Guidelines

    • Historical Version
  4. IPC 7525A


    Stencil Design Guidelines

    • Historical Version
  5. IPC 7525


    Stencil Design Guidelines

    • Historical Version