1779508

JEDEC JS 9703

IPC/JEDEC-9703: Mechanical Shock Test Guidelines for Solder Joint Reliability

standard by JEDEC Solid State Technology Association , 03/01/2009

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About This Item

 

Full Description

This document establishes mechanical shock test guidelines for assessing solder joint reliability of Printed Circuit Board (PCB) assemblies from system to component level.
 

Product Details

Published:
03/01/2009
Number of Pages:
46
File Size:
1 file , 3.7 MB
Note:
This product is unavailable in Russia, Ukraine, Belarus