1762612

JEDEC JESD22-B106D

RESISTANCE TO SOLDER SHOCK FOR THROUGH-HOLE MOUNTED DEVICES

standard by JEDEC Solid State Technology Association , 04/01/2008

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This method established a standard procedure for determining whether through-hole solid state devices can withstand the effects of the temperature to which they will be subject during soldering of their leads. This revision updates the references to currently military standards.
 

Product Details

Published:
04/01/2008
Number of Pages:
12
File Size:
1 file , 70 KB
Note:
This product is unavailable in Russia, Ukraine, Belarus
 

Document History

  1. JEDEC JESD22-B106E


    RESISTANCE TO SOLDER SHOCK FOR THROUGH-HOLE MOUNTED DEVICES

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    RESISTANCE TO SOLDER SHOCK FOR THROUGH-HOLE MOUNTED DEVICES

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