1762491

JEDEC JEP154

GUIDELINE FOR CHARACTERIZING SOLDER BUMP ELECTROMIGRATION UNDER CONSTANT CURRENT AND TEMPERATURE STRESS

standard by JEDEC Solid State Technology Association , 01/01/2008

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Full Description

This document describes a method to test the electromigration (EM) susceptibility of solder bumps, including other types of bumps, such as solder capped copper pillars, used in flip-chip packages. The method is valid for Sn/Pb eutectic, high Pb, and Pb-free solder bumps. The document discusses the advantages and concerns associated with EM testing, as well as options for data analysis.
 

Product Details

Published:
01/01/2008
Number of Pages:
34
File Size:
1 file , 370 KB
Note:
This product is unavailable in Russia, Ukraine, Belarus
 

Document History

  1. JEDEC JEP154A


    Guideline for Characterizing Solder Bump Electromigration under Constant Current and Temperature Stress

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  2. JEDEC JEP154

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    GUIDELINE FOR CHARACTERIZING SOLDER BUMP ELECTROMIGRATION UNDER CONSTANT CURRENT AND TEMPERATURE STRESS

    • Historical Version