The objective of this paper is to establish a thermal road map for telecom equipment. The intention of the authors is not to define a comprehensive thermal road map for telco equipment but rather to introduce the basis for a thermal road map that needs to be investigated and examined by the thermal community in this arena. The present paper also establishes the air cooling limit from the component, board, and system level in telecom equipment. Finally, it proposes a growing trend of the bandwidth verses power dissipation.

Units: SI