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ISO 9453:2006

Soft solder alloys - Chemical compositions and forms

standard by International Organization for Standardization , 10/01/2006

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Full Description

ISO 9453:2006 specifies the requirements for chemical composition for the following families of soft solder alloys:

  • tin-lead, with and without antimony, bismuth, cadmium, copper, and silver;
  • tin-antimony;
  • tin-bismuth;
  • tin-copper, with and without silver;
  • tin-indium, with and without silver and bismuth;
  • tin-silver, with and without copper and bismuth;
  • tin-zinc, with and without bismuth.

ISO 9453:2006 also includes an indication of the forms generally available.

 

Product Details

Published:
10/01/2006
File Size:
1 file , 190 KB
Same As:
BS EN ISO 9453:2006
Note:
This product is unavailable in Ukraine, Russia, Belarus
 

Document History

  1. ISO 9453:2020


    Soft solder alloys - Chemical compositions and forms

    • Most Recent

  2. ISO 9453:2014


    Soft solder alloys - Chemical compositions and forms

    • Historical Version

  3. ISO 9453:2006

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    Soft solder alloys - Chemical compositions and forms

    • Historical Version

  4. ISO 9453:1990


    Soft solder alloys - Chemical compositions and forms

    • Historical Version