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About This Item

 

Full Description

Includes Amendment 1 (June 2012); English only.

In answer to numerous industry requests for guidance on Electroless Nickel/Immersion Gold (ENIG), IPC-4552 has been developed. Containing full color photographs, this specification sets the requirements for the use of ENIG as a surface finish for printed circuit boards. It includes requirements for ENIG deposit thicknesses based on performance criteria. It will be an invaluable resource for use by suppliers, board fabricators, electronics manufacturing services (EMS) and original equipment manufacturers (OEMs). The specification's Appendix also includes a FREE copy of the highly sought after technical paper "Standard Developments Efforts of Electroless Nickel Immersion Gold" by George Milad and Gerard O'Brien.
 

Document History

  1. IPC 4552B


    Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards

    • Most Recent
  2. IPC 4552A


    Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards

    • Historical Version
  3. IPC 4552-WAM1-2


    Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards with Amendments 1 and 2

    • Historical Version
  4. IPC 4552

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    Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards, includes Amendment 1 and 2

    • Historical Version
 

Amendments, rulings, supplements, and errata

  1. IPC 4552 Amendment 1

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    Amendment 1 to Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards