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About This Item
Full Description
The purpose of this standard is to identify the classification level of non-hermetic SMDs designed for surface mount assembly that are sensitive to moisture-induced stress so that they can be properly packaged, stored, and handled to avoid damage during assembly solder reflow attachment and/or repair operations.
This standard may be used to determine what classification level should be used for non hermetic SMD qualification. Passing the criteria in this test method is not sufficient by itself to provide assurance of long-term reliability. The Moisture Sensitivity Levels (MSLs) rating generated for an SMD by this document is utilized to determine the soak conditions for preconditioning as per JESD22-A113 and how the SMD can be properly packaged, stored, and handled to avoid damage during assembly solder reflow attachment and/or repair operations as per J-STD-033.
For IC devices that may be process sensitive, please refer to J-STD-075 to determine if a PSL (Process Sensitivity Level) classification is required.
Document History
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IPC J-STD-020F
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Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices- Most Recent
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IPC J-STD-020E
Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices- Historical Version
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IPC J-STD-020D-1
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices- Historical Version
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IPC J-STD-020D
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices- Historical Version
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IPC J-STD-020C
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Device- Historical Version
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IPC J-STD-020B
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices- Historical Version
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IPC J-STD-020A
Moisture/Reflow Sensitivity Classification for Plastic Integrated Circuit Surface Mount Devices- Historical Version